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96J (Sumikon PM-9630)
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G
H NiZn (850ui)
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K10 NiZn (800 ui)
KOOL MU
M
M2
M24
M3
M33 MnZn (750 ui)
MPP
N22 MnZn (2300 ui)
N27 MnZn (2000 ui)
N30 MnZn (4300 ui)
N33
N41 MnZn (2800 ui)
N48 MnZn (2300 ui)
N49 MnZn (1500 ui)
N87 MnZn (2200 ui)
N92 MnZn (1500 ui)
N95 MnZn (3000 ui)
N97 MnZn (2300 ui)
P MnZn (2500 ui)
PC40
PC44
PC95
R MnZn (2300 µi)
T35 MnZn (6000 ui)
T37 MnZn (6500 ui)
T38 MnZn (10,000 ui)
T46 MnZn (15,000 ui)
T66 MnZn (13,000 ui)
V MnZn (2300 ui)
W MnZn (10,000 ui)
XFLUX
Z30 (Zytel 70G30 HSL)
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Manufacturers
Miles-Platts
Ametherm
TDK
EPCOS
Fair-Rite
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Proterial
Magnetics
National Magnetics
Rubadue
Toshiba
Product Type
Amorphous Cores
Bobbins & Accessories
Ferrite Cores
Powder Cores
Geometry Code
Bead – Chip
Bead – Flat Cable
Bead – Printed Circuit
Round Cable Core
Bead – Surface Mount
Block / Rectangle
Choke
Disc / Rod
Drum Core
E Core Family (Ferrites)
EER Core
E/EF Core
EFD Core
EMI Plate w/Holes
EP Core
EPC Core
EQ or ER Core
ETD Core
Header / Toroid Mount
I Core
Kit
Mounting Hardware
Multi-Aperture Core (Balun)
PM Core
Pot Core Family
PQ Core
PS Core
PT & RS Core
PTS & DS Core
RM Core
Sleeve / Tube
Tape Wound Core
Themistor
Toroid – Epoxy
Toroid – Nylon
Toroid – Parylene
Toroid – Uncoated
U Core
UR Core
Material Grades
62
63
98
3E25 (6000 ui)
3E27 MnZN (6000 ui)
3B1
3C30
3C85
3C90 MnZn (2300µi)
3C95 MnZn (3000µi)
3F3 MnZn (2000µi)
3H3
4A1
4C6
4C65 NiZn (125 ui)
96J (Sumikon PM-9630)
More Material Grades
AMOFLUX
B (5000 ui)
C MnZn (900 ui)
D
E MnZn (2000 ui)
F MnZn (3000 ui)
F5
FGN (Technyl A20 V25)
FT-3AM
FT-3K50T
FT-3k70T
FT-3KL
FT-3KM
FT-3KS
FT-8K50D
G
H NiZn (850ui)
HIGH FLUX
J MnZn (5000 ui)
J/B
K
K1 NiZn (80 ui)
K10 NiZn (800 ui)
KOOL MU
M
M24
M3
M33 MnZn (750 ui)
MPP
N22 MnZn (2300 ui)
N27 MnZn (2000 ui)
N30 MnZn (4300 ui)
N33
N41 MnZn (2800 ui)
N48 MnZn (2300 ui)
N49 MnZn (1500 ui)
N87 MnZn (2200 ui)
N92 MnZn (1500 ui)
N95 MnZn (3000 ui)
N97 MnZn (2300 ui)
P MnZn (2500 ui)
PC40
PC44
PC95
R MnZn (2300 µi)
T35 MnZn (6000 ui)
T37 MnZn (6500 ui)
T38 MnZn (10,000 ui)
T46 MnZn (15,000 ui)
T66 MnZn (13,000 ui)
V MnZn (2300 ui)
W MnZn (10,000 ui)
XFLUX
Z30 (Zytel 70G30 HSL)
Materials Menu
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MULTI-LAYER CHIP BEAD
Part Number:
2518061517Y0
Product Details
MULTI-LAYER CHIP BEAD
Part Number:
2518061017Y0
Product Details
MULTI-LAYER CHIP BEAD
Part Number:
2512067007Y0
Product Details
